Hunan More Than Moore Advanced Semiconductor Co.,Ltd. (referred to as MTM) was established in October 2020, with a registered paid-in capital of 460 million CNY, and the actual investment capital has exceeded 800 million CNY. The company is headquartered in Zhuzhou, Hunan Province, with branches in Beijing, Shanghai, Shenzhen, Changsha and other places. MTM has the world's leading advanced packaging technology, providing packaging design, multi-physical field simulation, one-stop SiP advanced packaging mass production services.

The company's advanced products include computing products, Beidou navigation, automotive electronics, industrial control, power management, storage, biomedical, wearable, Internet of Things, etc., and has established good cooperative relations with more than 200 customers.

With advanced delivery capabilities and reliable quality, MTM has more than 51,000 square meters of production facilities and completed packaging product lines including Chiplet, SiP, LGA/BGA, CSP, QFN/DFN, etc. With unremitting spirit of innovation, excellent teamwork and high-quality products and services, we create higher value for customers and constantly promote the development and progress of the packaging industry.